Power Management.................................................................................................................................. 4 Self Diagnosis Function ............................................................................................................................ 4 Timing SpeciÞcation.................................................................................................................................. 4 Warnings and Cautions............................................................................................................................. 5 Safety Check Out Instructions .................................................................................................................. 6 1. Disassembly 1-1. Cabinet Removal ............................................................................................................................... 7 1-2. Service Position................................................................................................................................. 7 1-3. A and D Board Removal .................................................................................................................... 8 1-4. Picture Tube Removal ....................................................................................................................... 9 Anode Cap Removal ......................................................................................................................... 9 2. Safety Related Adjustments 2-1. HV Regulator Check........................................................................................................................ 10 2-2. HV Protector Circuit Check.............................................................................................................. 10 2-3. Beam Protector Check (Software Logic) ......................................................................................... 10 2-4.B+ Voltage Check ............................................................................................................................. 10 3. Adjustments 3-1. Landing Rough Adjustment ..............................................................................................................11 3-2. Landing Fine Adjustment ..................................................................................................................11 3-3. Convergence Rough Adjustment......................................................................................................11 3-4. Convergence and V. Key (H. TRP) Fine Adjustment ........................................................................11 3-5. Vertical and Horizontal Position and Size SpeciÞcation .................................................................. 12 3-6. Focus Adjustment ............................................................................................................................ 12 3-7. Digital Convergence Adjustment ..................................................................................................... 13 3-8. Convergence SpeciÞcation.............................................................................................................. 13 4. Diagrams 4-1. Circuit Boards Location ................................................................................................................... 14 4-2. Schematic Diagrams And Printed Wiring Boards ............................................................................ 14 4-3. Block Diagram ................................................................................................................................. 15 A Board - Schematic Diagram......................................................................................................... 17 D Board - Schematic Diagram ........................................................................................................ 19 H1 Board - Schematic Diagram ...................................................................................................... 23 4-4. Semiconductors............................................................................................................................... 24 5. Exploded Views 5-1. Picture Tube .................................................................................................................................... 25 5-2. Chassis............................................................................................................................................ 26 5-3. Packing Materials ............................................................................................................................ 27 6. Electrical Parts List ....................................................................................................................................... 28