The Model 7072 Semiconductor Matrix Card is designed specifically to handle low-level and high- impedance measurements encountered in semiconductor parametric tests on wafers and devices. This unique design provides two lowcurrent circuits with specified 1pA maximum offset current for sensitive subpicoamp measurement resolution, and two C-V paths for measurement of Capacitance Voltage characteristics from DC to 1MHz. Four additional highquality signal paths with <20pA offset current provide for general-purpose signal switching up to 100nA or 200V. Connections are 3-lug triax with the outer shell connected to chassis for safety and noise shielding. The center conductor is fully surrounded by the inner conducting shield, so that fully guarded measurements can be made to achieve higher isolation and to improve measurement speed and accuracy. Isolation relays on the low-current and C-V paths automatically disconnect unused circuits to achieve minimum interference and peak performance. The 707A or 708A mainframe allows each row (signal path) to be programmed for Break-Before-Make or Make-Before-Break operation.